High Reliability
Low Insertion
RoHS Compliant
Low Temperature Correlation
Data Center and QSFP Modules
Fig.1 MUX with LC Stub and Receptacle

Fig.2 Demux with LC Receptacle

Note: fiber length, fiber type, LC stub and receptacle can be customized.
| Item | Condition/ Measure Method | Symbol | Unit | Type | |
| Mux | Demux | ||||
| Channel | CH | 4 | |||
| Spacing | Space | nm | 20 | ||
| CWL | 25℃@3dB Center | λC | nm | CH1:1271 | |
| CH2:1291 | |||||
| CH3:1311 | |||||
| CH4:1331 | |||||
| CWL Accuracy | 25℃@3dB Center | △λC | nm | ±1 | |
| 1dB Bandwidth | BW1dB | nm | ≥12 | ≥12 | |
| 3dB Bandwidth | BW3dB | nm | ≥15 | ≥15 | |
| Channel Uniformity | All channel ILmax-ILmin | Unit 1 | dB | ≤0.7 | |
| Chip Uniformity | All chip ILmax-ILmin | Unit 2 | dB | ≤2 | / |
| Insertion Loss | @Passband±5nm;Including PDL and fiber coupling | IL | dB | 2~3.5 | ≤2.5 |
| Polarization Dependent Loss | Passband±1nm | PDL | dB | ≤0.5 | |
| Ripple | Passband±5nm | R | dB | ≤1.0 | |
| Return Loss | RL | dB | ≥40 | ||
| Isolation(Adjacent) | Passband±6.5nm | Iso | dB | / | ≥20 |
| Isolation(Non-Adjacent) | Passband±6.5nm | Iso | dB | / | ≥20 |
| Polarization Mode Dispersion | PMD | PS | ≤0.15 | ≤0.15 | |
| Temperature Dependent Loss | -50~+85℃ | TDL | dB | ≤0.2 | ≤0.2 |
| Wavelength thermal stability | WTS | Nm/℃ | ≤0.012 | / | |
| Channel Pitch | um | 500 | 250 | ||
| Input/ Output Side | Identical Side | Opposite Side | |||
| Chip Size | Max Size | mm | ≤7.6*4.0 | ≤10.2*1.6 | |
| Chip Height | mm | ≤1.3 | ≤1.0 | ||
| Operating Temperature | ℃ | -5~+80 | |||
| Storage Temperature | ℃ | -40~+85 | |||
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