High Reliability
Low Insertion
RoHS Compliant
Low Temperature Correlation
Data Center and QSFP Modules
Fig.1 MUX with LC Stub and Receptacle
Fig.2 Demux with LC Receptacle
Note: fiber length, fiber type, LC stub and receptacle can be customized.
Item | Condition/ Measure Method | Symbol | Unit | Type | |
Mux | Demux | ||||
Channel | CH | 4 | |||
Spacing | Space | nm | 20 | ||
CWL | 25℃@3dB Center | λC | nm | CH1:1271 | |
CH2:1291 | |||||
CH3:1311 | |||||
CH4:1331 | |||||
CWL Accuracy | 25℃@3dB Center | △λC | nm | ±1 | |
1dB Bandwidth | BW1dB | nm | ≥12 | ≥12 | |
3dB Bandwidth | BW3dB | nm | ≥15 | ≥15 | |
Channel Uniformity | All channel ILmax-ILmin | Unit 1 | dB | ≤0.7 | |
Chip Uniformity | All chip ILmax-ILmin | Unit 2 | dB | ≤2 | / |
Insertion Loss | @Passband±5nm;Including PDL and fiber coupling | IL | dB | 2~3.5 | ≤2.5 |
Polarization Dependent Loss | Passband±1nm | PDL | dB | ≤0.5 | |
Ripple | Passband±5nm | R | dB | ≤1.0 | |
Return Loss | RL | dB | ≥40 | ||
Isolation(Adjacent) | Passband±6.5nm | Iso | dB | / | ≥20 |
Isolation(Non-Adjacent) | Passband±6.5nm | Iso | dB | / | ≥20 |
Polarization Mode Dispersion | PMD | PS | ≤0.15 | ≤0.15 | |
Temperature Dependent Loss | -50~+85℃ | TDL | dB | ≤0.2 | ≤0.2 |
Wavelength thermal stability | WTS | Nm/℃ | ≤0.012 | / | |
Channel Pitch | um | 500 | 250 | ||
Input/ Output Side | Identical Side | Opposite Side | |||
Chip Size | Max Size | mm | ≤7.6*4.0 | ≤10.2*1.6 | |
Chip Height | mm | ≤1.3 | ≤1.0 | ||
Operating Temperature | ℃ | -5~+80 | |||
Storage Temperature | ℃ | -40~+85 |
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